Effect of CeO2 and CuO oxide nanoparticles on the nickel electroplating in sulfate solution

Abstract

This study investigates the electrochemical behavior of nickel composite coatings containing CuO and CeO₂ nanoparticles using polarization and electrochemical impedance spectroscopy (EIS). The presence of CuO or CeO₂ oxide nanoparticles in the solution with the ranges between 2 and 12 g/L insignificant increased cathode polarization in the nickel sulfate plating solution. However, the EIS results showed that CuO particles had little effect on the solution resistance and plating process, while CeO₂ particles significantly increased the solution resistance, thus affecting the nickel plating rate. The solution's charge transfer resistance would rise due to the high concentration of added oxide particles, which will be detrimental to the electrode surface's deionization process, the plating solution's oxide particle content should not exceed 12 g/L.