GOLD ALLOY (Cu, Ni, Co) PLATING TECHNOLOGY ANDAPPLICATIONS IN ELECTRONICS

Abstract

Gold and its alloy plates were created by plating in the buffer solution with pH = 4,5. The source of Ni²⁺ and Co²⁺ cations were provided via single salts, while that of Au⁺ and Cu²⁺ cations were taken from their complex with CNanion, and EDTA, respectively. The properties of the obtained alloys depend on composition of solution and plating condition, therefore it is possible to control them following desired directions. Using several tests such as: hardness, specific electrical resistance, contact electrical resistance, it has been proved that golden metal and its obtained alloys plating exhibited the same corrosion resistance, conductivity and contact electrical resistance; however the plating provided much better hardness and abrasion resistance. Hence, golden alloys’plating is suitable for plating electrical contactors with high reliability. The compositions of solution and conditions for preparation of golden alloys’ plate as well as the results obtained from practical applications are also given in this paper